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With the backing of the Innovation, Technology, and Industry Bureau and the Office for Attracting Strategic Enterprises (OASES), the Hong Kong Science and Technology Parks Corporation (HKSTP) has signed a Memorandum of Understanding (MoU) with a microelectronics company based in mainland China.
The aim of this partnership is to establish a global Research and Development (R&D) Center focused on third-generation semiconductors at the Hong Kong Science Park and to set up Hong Kong’s first Silicon Carbide (SiC) 8-inch advanced wafer fab. This landmark initiative represents a crucial step in the Hong Kong Special Administrative Region (HKSAR) Government’s vision of becoming a leading microelectronics hub in the region.
The Secretary for Innovation, Technology, and Industry emphasised the HKSAR Government’s dedication to turning its ‘new industrialisation’ vision into tangible actions. The partnering company plays an active role in enhancing the capacity, quality, and competitiveness of Hong Kong’s tech talent pool.
Moreover, the project is expected to catalyse the development of related industries, including semiconductor equipment manufacturers and material suppliers, creating a comprehensive ecosystem that will solidify Hong Kong’s position in the global semiconductor industry value chain.
Hong Kong’s strategic importance in the semiconductor industry cannot be overstated. It stands at the heart of the Greater Bay Area, a region with immense potential to become a key player in the global semiconductor supply and value chain. This partnership between HKSTP and J2 Semiconductor is a testament to the government’s ambition to establish Hong Kong as a leader in microelectronics and semiconductors, aligning with the core objectives outlined in the “Hong Kong Innovation and Technology Development Blueprint.”
The Chairman of HKSTP noted that the establishment of the new centre in the Science Park would significantly boost Hong Kong’s R&D and advanced manufacturing capabilities in the realm of third-generation semiconductor devices. The partnering company brings to Hong Kong critical technology and expertise in advanced chip design, fabrication processes, and semiconductor product development, marking a pivotal moment in the evolution of Hong Kong’s microelectronics industry. With its extensive infrastructure and partner network, HKSTP is primed to propel Hong Kong’s microelectronics R&D capabilities and reinforce its position as an international innovation and technology hub.
Meanwhile, the microelectronics company noted that the MoU signifies the official commencement of the third-generation semiconductor ‘SiC 8-inch advanced wafer fab’ project. The firm is poised to invest an estimated HK$6.9 billion into the project, with plans to commence volume production in the next couple of years. By 2028, it aims to achieve an annual production capacity of 240,000 SiC wafers, generating an annual production value exceeding HK$11 billion and creating over 700 job opportunities in Hong Kong. This project is expected to expedite the localization of the new energy vehicle supply chain and contribute to the long-term development and prosperity of the semiconductor industry in Hong Kong.
HKSTP is committed to advancing Hong Kong’s new industrialisation mission and establishing a world-leading microelectronics ecosystem. An extensive network of microelectronics hardware infrastructure, including the Sensor Packaging and Integration Laboratory (Sensor Lab), Heterogeneous Integration Lab (HI Lab) and Hardware Lab has already been set up. These facilities support the complete process of design, prototyping, and pilot production of chip-related equipment, systems, and products.
Additionally, the Microelectronics Centre at the Yuen Long Innovation Park is set to commence operations in 2024, further enhancing HKSTP’s infrastructure to expedite microelectronics R&D pilot production and create opportunities for upstream and downstream enterprises within the industry.
OpenGov Asia reported that HKSTP, in collaboration with the Hong Kong University of Science and Technology (HKUST) and a semiconductor supplier in Hong Kong held a microelectronics conference at the Hong Kong Science Park. Various stakeholders from the industry, academia, and research sectors, gathered to elevate Hong Kong’s status as a global leader in microelectronics innovation and talent development.
The primary focus was on key innovation areas, including smart mobility, healthcare, and new energy. Distinguished leaders and experts in the global microelectronics arena shared their insights across three conference tracks: talent, research, and industry, with the aim of inspiring the next generation of professionals.
